The Small Form Factor (SFF) Solution 760-92 rugged electronic packaging design from Atrenne Integrated Solutions, Inc. enables deployment of off-the-shelf Mini-ITX and PCIe commercial electronics circuit card assemblies (CCAs) in the size, weight, power, and cost (SWaP-C)-constrained hars...
PHOENIX. In a contract with the Defense Advanced Research Projects Agency (DARPA) engineers at Honeywell will continue to improve three-dimensional visibility and safety for U.S. military helicopter pilots experiencing inclement weather and harsh environments.
Extended Temperature Device and Testing Advancements for COMs and SFF SBCs Enable Reliable, Long Life Systems
Designing a system using extended temperature components is the most effective method to ensure reliable functionality in an extreme temperature range is met.