GE Intelligent Platforms High Performance Embedded Computing takes advantage of the technologies and architectures widely deployed in commercial High Performance Computing environments, bringing to the embedded mil/aero world the advantage of their cost-effectiveness, proven performance and extensive support infrastructure and adding the ruggedness that enables them to be deployed in the most challenging situations. As sensor-derived data increases in volume, complexity and criticality, GE Intelligent Platforms HPEC platforms and subsystems from GE are helping mil/aero customers to solve some of todays most demanding problems.
In Military, Aerospace and First Responder applications, System Integrators targeting highly rugged applications often utilize conduction cooled modules because of their superior performance in harsh environments.
GPUDirect support for RDMA provides low latency interconnectivity between NVIDIA GPUs and various networking, storage, & FPGA devices. This white paper will include how CUDA 5 technology increases GPU autonomy and promotes multi-GPU topologies with high GPU-to-CPU ratios. In addition to improved bandwidth and latency, the resulting increase in GFLOPS/watt poses a significant impact to both HPC & embedded applications. We will dig into scalable PCIe switch hierarchies, as well as software infrastructure to manage device interoperability & GPUDirect streaming.
The external world has a wide mix of I/O interfaces. Any FPGA module to be used must meet that interface.
VITA 46, 48, and 65: The Next Generation VME system replacement. VITA 46 is the VPX base electrical and mechanical specification. VITA 48 is the VPX REDI cooling spec. VITA 65 is Open VPX. Open VPX was the industry's attempt to bring order to chaos. Open VPX methodically defines a system of profiles that would fully explain the interactions between the backplane and plug-in modules. The profiles are the physical mapping of resources in the system. This information can then be used to determine compatibility.
This paper presents the thermal analysis performed on an aircraft engine Electronic Control Unit (ECU) installed in the engine environment. Part of the nacelle and ECU are modeled with and without cooling air, as specified by the engine manufacturer. Different geometric configurations are simulated providing boundary conditions for a detailed thermal analysis of the ECU itself.
Using Computational Fluid Dynamics (CFD) is no longer relegated to the realm of the specialist. A new class of CFD analysis software is proving to be highly effective at performing heat transfer analysis, enabling mechanical engineers to accelerate key decisions at their workstations and without the need for CFD specialists. Embedded into the MCAD environment, this intuitive process allows designers to optimize a product during the design stages reducing manufacturing costs across a wide range of mechanical designs and systems.
The counterfeiting of semiconductor components is escalating at an unprecedented rate. With increasingly sophisticated methods, counterfeit components are produced in many areas of the world and distributed globally. Additionally, unauthorized distributors render genuine parts substandard through improper handling. To make matters worse, semiconductors are being altered through a practice known as "malicious insertion" to cause damage or failure to the parts in which they are installed, or to gather intelligence.
The folks at Pentek, who wrote the book on Software Radio, are pleased to announce their recently released and expanded Software Radio Handbook. Downloaded thousands of times, the handbook has proved to be a useful technical reference for engineers.
The Symmetricom(r) QUANTUM(tm) Chip Scale Atomic Clock (SA.45s CSAC) delivers the accuracy and stability of an atomic clock to portable applications for the first time. That means that when it comes to the next era in atomic timekeeping, the clock is already running.