Telum ASLP11

GE Intelligent Platforms, Inc.

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Telum ASLP11
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FEATURES

  • High performance processor AdvancedMC module
  • Up to 4 GB of ECC memory
  • Intel Core 2 Duo L7400 1.5 GHz CPU
  • Single width, full- or mid-sized AdvancedMC processor board
  • Suitable for distributed / processing applications such as base stations, voice over packet, test and measurement, server blades, and other enterprise-wide computing
  • Onboard x8 PCI Express controller and associated FCLKA fabric clock may be configured as either the root controller for a subtending PCI Express subnet or as an end node (target) on a PCI Express subnet
  • Defined by the host system during power up, this provides customers with superior flexibility and enhanced price/performance as it allows the host system to deploy distributed processing resources to support more sophisticated network applications
  • Designed to be more reliable through the use of solder to attach all components to the board ? enhancing its resistance to shock and vibration
  • Optionally available in an extended temperature variant (-40 ?C to +55 ?C) to allow deployment in, for example, exterior locations
  • Onboard 2 GBNAND Flash module, which may be optionally upgraded for applications requiring greater memory capacity
  • Two Gigabit Ethernet ports and two SATA ports
  • Watchdog and temperature sensors
  • USB 2.0 ports and a COM serial port optionally available
  • Supported operating systems include standard distribution and
  • The Module Management Controller (MMC) on the ASLP11 supports the Intelligent Platform Management Interface () v2.0 architecture as defined in the AMC.0 specification and is responsible for power sequencing, hot swap, and overall module management
  • The MMC allows independent platform management between all AdvancedMC modules, carrier, power supplies, fans, and other accessories in a system
  • This feature may be used for autonomous monitoring, logging, and recovery control functions

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