Real3 3D Image Sensor

Infineon Technologies Corporation

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Infineon and pmdtechnologies announced the second generation of the jointly developed REAL3 3D image sensor chip portfolio. Combined with infrared cameras, imaging systems based on REAL3 chips can enhance virtual reality game experiences that involve gamerís hands and their living environment. Other applications involve spatial measurement of rooms and objects, indoor navigation, and implementation of special photo effects. The new generation 3D image sensor chips double the pixel sensitivity to measure intensity of emitted and reflected infrared light. Googleís ìproject Tangoî uses this technology to provide 3D perception in smartphones and tablets.
Real3 3D Image Sensor

FEATURES

  • Highly integrated and sophisticated 3D Time-of-Flight (ToF) imager
  • The ToF sensors have been jointly developed by Infineon and pmdtechnologies gmbh
  • Embed a high performance ToF pixel-matrix from pmd and are manufactured in Infineon’s volume-proven CMOS process which enabled Infineon to integrate the photosensitive area together with mixed signal circuitry into a single chip
  • REAL3™ Image Sensor family brings together all ingredients to establish 3D technology in high volume consumer applications: robust and accurate depth data by meeting size and power consumption requirements of mobile devices.

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