Remedies for Your Obsolescence Headaches

Micross Components Headquarters

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We offer a complete turnkey package, replacing an unavailable part with a matching part using current technology


  • In-house talent and facilities for design, product engineering, manufacturing, test and qualifications
  • Die sourcing and long term die storage
  • Ceramic and metal can assembly
  • Plastic package form, fit, and function replacement
  • Footprint adaptors
  • ASIC design
  • Upscreening
  • Test and qualification capabilities
  • MIL-PRF-38534 Class H, MIL-PRF-38535 Class Q and Class V (assembly)
  • AS9100:2009-C and ISO9001:2008

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