Military Embedded Systems

DARPA, SIA initiative aims to advance transformative semiconductor technologies

News

June 02, 2017

Lisa Daigle

Assistant Managing Editor

Military Embedded Systems

DARPA, SIA initiative aims to advance transformative semiconductor technologies
Image: DARPA

WASHINGTON. The Defense Advanced Research Projects Agency (DARPA) and the Semiconductor Industry Association (SIA) are teaming to work on a $75 million project -- contained in the Department of Defense (DoD) proposed FY 2018 budget -- in support of a new public/private ?electronics resurgence? initiative.

The initiative aims to sustain a new era of electronics in which advances in performance will be catalyzed not just by continued component miniaturization but also by research and development of radically new microsystem materials, designs, and architectures. The newly allocated funds will supplement DARPA's FY 2018 R&D portfolio in electronics, photonics, and related systems to create a coordinated effort valued at more than $200 million. The plan is that these monies will be additionally supplemented by significant commercial sector investments.

Over the coming months, DARPA’s Microsystems Technology Office (MTO) will connect with the microelectronics community through technology discussions, workshops, and other channels to draw up a collaborative, cost-shared research agenda; these plans will complement DARPA’s recently created Joint University Microelectronics Program (JUMP), the largest university research effort in basic electronics, cofunded by DARPA and industry consortium Semiconductor Research Corporation.

DARPA says that in addition to fostering advancements in semiconductor technologies used for national security, the ripple effect from this research will be felt across the full range of semiconductor applications, including communications, computing, health care, transportation, and clean energy.

 

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