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Next-Gen Solutions for Flight and Ground Applications on Display at New-Tech 2017

TE Connectivity
TE Connectivity at New-Tech 2017
TE Connectivity at New-Tech 2017

Members of the media are invited to visit TE Connectivity (TE) at booth #92 during the New-Tech 2017 Exhibition, to learn about TE’s advances in antenna technology for its smaller and lighter components in military and aerospace markets. TE will display some of its high-speed connector and cabling solutions for most harsh environments.

TE’s advancements in material science help enable next-generation technologies in antennas, such as low-profile conformal antennas. Recent developments in glass fiber composites can help reduce weight up to 40 percent compared to the aluminum enclosures they replace. Changes in materials can simplify manufacturing processes and help improve overall performance in antenna systems.

At New-Tech 2017, TE will display an array of high-speed connector and cabling solutions, including

- CeeLok FAS-T connector family – Designed for next-generation systems to help meet SWaP (size, weight and power) needs, CeeLok FAS-T connectors are among the smallest, most rugged 10 GB Ethernet connectors in the aerospace and defense market.

- Raychem high-speed copper cables – TE’s high-speed copper cable solutions can help increase the performance and signal integrity in many modern aerospace and military applications. These cables are also compatible with the CeeLok FAS-T connector range.

TE’s engineers will be available for interviews at the booth throughout the show.

SHOW: New-Tech 2017 Exhibition – Booth #92

DATE: May 23-24, 2017

WHERE: Israel Trade Fairs Center

Tel-Aviv, Israel

Source: TE Connectivity