News ID

ATS' maxiGRIP Heat Sink Attachment System Passes Tough Military Shock Testing

Advanced Thermal Solutions, Inc.

NORWOOD, Mass, November 1, 2006 – Advanced Thermal Solutions, Inc. (ATS), a leading thermal management and mechanical packaging solutions provider, today announced that maxiGRIP™, the company's patent-pending heat sink attachment system for mounting heat sinks to flip chips, BGAs, and other hot on the PCB components, has passed Mil-STD-810 Shock Testing and Unpackaged Drop Testing.

About Advanced Thermal Solutions, Inc.

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