Military Embedded Systems E-letter - September 2014
 
 
E-letter September 2014
StarVX -- A generic scalable computer architecture
By Kontron
Kontron's StarVX is an HPEC system that brings supercomputing I/O bandwidth and performance to harsh military environments.
SECTION: Defense Tech Wire
Defense electronics and 3D printing
By John McHale, Editorial Director
Additive manufacturing, better known as 3D printing, has made its way into the military embedded computing realm as suppliers are using the technology to speed up their production and reduce development costs.
SECTION: Market Analysis
U.S. military market is a sustainment market
By John McHale, Editorial Director
U.S. Department of Defense (DoD) budget cuts and sequestration combined with a shrinking U.S. military footprint abroad have created an uncertain marketplace, leaving many to wonder where the business opportunities will be. However, market analysts and distributors of electronic components don't see it so much as a shrinking market, but rather one that is evolving and shifting toward sustainment.
Special Report
Next-gen shipboard electronics enhance data sharing and automation
By Sally Cole, Senior Editor
New design trends for shipboard electronics, such as those onboard the U.S. Navy's Littoral Combat Ship, focus on enabling enhanced data sharing capabilities and automation, along with a heavy emphasis on being prepared for electronic warfare.
SECTION: Mil Tech Trends
Rugged handheld evolve to meet warfighter needs
By Amanda Harvey, Assistant Editor
Designers of rugged handheld computers and tablets for the military market are upgrading designs to meet the changing needs of warfighters on the frontline.
The cutting edge of thermal management
By Brian Hoden, GE Intelligent Platforms, Inc.
The biggest challenge for system integrators today is thermal management. With access to the latest-generation processors, GPUs, and switch fabrics, system integrators must find creative ways to remove the heat created by this vast computing power. These thermal challenges call for innovative thermal solutions to maximize the performance for computing-intensive applications.
SECTION: Industry Spotlight
Eradicating device obsolescence
By George Karalias, Rochester Electronics
Device obsolescence is the status of a part when it is no longer available. The problem of obsolescence is very prevalent in microelectronics technology as the life cycles for microelectronic parts are often in conflict with equipment life cycles. In addition, microelectronics technology has a long history of obsolescence issues.
Is open delaying the future of cognitive computing?
By Dr. Ian Dunn, Mercury Systems
Open systems have the intended and unintended consequence of delaying innovation in computing. While industry players agree to standardize and build complex systems that eventually become useful products, this process can be lengthier than a single organization working alone.
SECTION: White Papers
Improving software development efficiency via model-based system engineering
By Esterel Technologies, a subsidiary of ANSYS, Inc.
Model-based technology makes software development and management much more efficient and can generate ICDs for the developer, but it does come with its own set of challenges.
SECTION: Sister Publication Article
PC/104 and UASs: The beauty of the system
By Mike Southworth, Curtiss-Wright Defense Solutions
Good things really do come in small packages: It's as though small, lightweight PC/104-based subsystems and Unmanned Aircraft Systems (UASs) for defense and aerospace applications were made for each other.
Rochester Electronics
LM110 Voltage Follower Re-introduced by Rochester Electronics
Parvus Corporation
Rugged Ethernet switches from Curtiss-Wright available standalone or with integrated Cisco router
Sensoray
Rugged, Industrial Strength PCIe/104 Form Factor A/V Codec
WinSystems
Fanless -40° to +85°C 1.66GHz Atom™ PC/104-Plus SBC
TTI, Inc.
TTI stocks Ruggedized Optical Backplane Interconnects from TE Connectivity
VPT
Rugged MIL-COTS DC-DC Converters
Pico Electronics
Ultra Miniature Surface Mount Audio Transformers
North Atlantic Industries
SIU31 – 3U cPCI Sensor Interface Unit
Esterel Technologies
Production-Proven Critical Systems and Software Development Solutions
HARTING Technology Group
We have your solution – DIN 41 612 connectors
Schroff
Calmark and Birtcher Brands are now Schroff
Data Device Corporation (DDC)
Space Level, High-Reliability Data Bus & Motion Control Solutions!
Elma Electronic
Elma's SFF Compute Platforms Expand
VadaTech
RADAR Data Processing Solutions Offer Higher Performance at Half the Cost
TEWS Technologies
PMC with 16/8 Channel Isolated Simultaneous Sampling AD/DA
Annapolis Micro Systems
Dual Twelve Bit 2.3 or 1.5 GSps DAC I/O Card
Intel Embedded Innovator
Shrinking Time & Cost for IoT Solutions
Advanced Micro Peripherals
New H.264 video streamer/recorder boards are intelligent, standalone and rugged
Innovative Integration
Prepare for Glory with FMC-500 2x500 MSPS 16-bit A/D 2x1230 MSPS 16-bit D/A
Proto Labs
Proto Labs Now Offering Liquid Silicone Rubber Molding
Connect Tech, Inc.
COM Express + GPU Embedded System from Connect Tech
Themis Computer
Themis NanoPAK Small Form Factor Computer
ADLINK Technology
ADLINK’s Rugged SWaP-optimized 6U VPX Radar Solution
SECTION: Upcoming E-Casts.  An E-cast is a live webcast that may have a single or multiple vendors. E-cast events are used to educate audiences about a problem/solution, from the vendor's perspective. The presentation is typically 45 minutes in duration with a 15-minute moderated Q&A session.
SYNOPSIS: A one-hour, live, moderated problem/solution technical webcast.

The Anatomy of IoT: Features, Functions, and Capability

October 22nd, 2:00 PM EDT
Presented by: Echelon, PrismTech, Telit, Xively

Managing SWaP in ISR Systems

December 4th, 2:00 PM EST
Presented by: Advanced Cooling Technologies, Curtiss-Wright, GE Intelligent Platforms, TE Connectivity
For additional E-casts, check out the Broadcast Archive.

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