TEWS TECHNOLOGIES Introduces PCI Express x4, Gen3 XMC Carrier for Process Control, Simulation, COTS, and Telecommunications Applications

TEWS Technologies

The TPCE278 is a standard height PCI Express Revision 3.0 compatible module that provides one slot for a single-width XMC module used to build modular, flexible and cost effective I/O solutions for all kinds of applications like process control, simulation, COTS, and telecommunications.

The TPCE278 is a versatile solution to upgrade well known XMC I/O solutions to the PCI Express signaling standard.

The PCI Express x4 link from the host board to the XMC module is enhanced by a PCIe Gen3 Redriver, allowing safe operation of XMC modules on PCIe mainboards.

VPWR is selectable via order option. The TPCE278-x0R variants provide 12V VPWR and the TPCE278-x1R order options provide 5V VPWR.

The TPCE278 supports XMC front panel I/O, and also P14 and P16 rear I/O independently.
XMC P14 rear I/O is provided through a Tyco AMPMODU System 50 0.050x0.100 flat ribbon cable connector. The I/O lines are routed differentially. XMC P16 rear I/O is implemented through two Samtec QTH-DP 0.50mm Q Pairs® High Speed Ground Plane Socket Strip, Differential Pair connector providing access to all P16 I/O lines.

The PCIe edge card connector provides +12V and +3.3V. The TPCE278-1xR uses the +12V of the PCIe edge card connector to generate all power supply voltages for the XMC slot (+3.3V, VPWR and +12V).

According to the PCIe specification, a PCIe x4 card is allowed to use 25W on the +12V which allows to operate most of the available XMC modules on the TPCE278-1xR. For increased power requirements of an XMC module, the TPCE278-2xR offer a PCIe Graphics Power Connector to supply the +12V for generating all the power supply voltages for the XMC slot providing power of up to 75W.

A 10-pin JTAG header is available for XMC module debugging purposes. All five JTAG signals are routed directly to the XMC slot.

About TEWS TECHNOLOGIES
TEWS TECHNOLOGIES is a leading solutions provider of embedded I/O and CPU products based on open architecture standards such as , XMC, IndustryPack® (IP), , standard PCI, PCIe, AMC, FMC, and VME. TEWS has more than 30 years of experience designing and building turn-key embedded interface solutions using the philosophy to listen and respond to our customers' needs. Using this 'customer first' approach, TEWS has developed a large number of standard and custom products for industrial control, telecommunication infrastructure, medical equipment, traffic control and COTS applications. TEWS' line of embedded I/O solutions is available worldwide through a global network of distributors. For more information, go to www.tews.com.

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